BDN09-3CB/A01
CTS Thermal Management Products
Product No:
BDN09-3CB/A01
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEATSINK CPU W/ADHESIVE .91"SQ
Quantity:
Delivery:
Payment:
In Stock : 2045 
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
2.7075
2.7075
10
2.64005
26.4005
25
2.56918
64.2295
50
2.4263
121.315
100
2.28361
228.361
250
2.140844
535.211
500
2.069499
1034.7495
1000
1.855407
1855.407
5000
1.819725
9098.625
Not the price you want? Send RFQ Now and we'll contact you ASAP.
Product Information
Parameter Info
User Guide
| Mfr | CTS Thermal Management Products |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 0.910" (23.11mm) |
| Length | 0.910" (23.11mm) |
| Series | BDN |
| Package | Box |
| Diameter | - |
| Material | Aluminum |
| Fin Height | 0.355" (9.02mm) |
| Shelf Life | 24 Months |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Base Product Number | BDN09 |
| Thermal Resistance @ Natural | 26.90°C/W |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | 9.60°C/W @ 400 LFM |
Recommended Parts
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
Quick Links
