BDN10-3CB/A01
CTS Thermal Management Products
Product No:
BDN10-3CB/A01
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEATSINK CPU W/ADHESIVE 1.01"SQ
Quantity:
Delivery:
Payment:
In Stock : 3591 
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
2.3845
2.3845
10
2.3218
23.218
25
2.2591
56.4775
50
2.13351
106.6755
100
2.008015
200.8015
250
1.88252
470.63
500
1.819782
909.891
1000
1.63153
1631.53
5000
1.600161
8000.805
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Product Information
Parameter Info
User Guide
| Mfr | CTS Thermal Management Products |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 1.010" (25.65mm) |
| Length | 1.010" (25.65mm) |
| Series | BDN |
| Package | Box |
| Diameter | - |
| Material | Aluminum |
| Fin Height | 0.355" (9.02mm) |
| Shelf Life | 24 Months |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Base Product Number | BDN10 |
| Thermal Resistance @ Natural | 26.40°C/W |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | 8.00°C/W @ 400 LFM |
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2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
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