ESQT-113-02-M-D-553

Samtec Inc.

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ESQT-113-02-M-D-553

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Description:

CONN SOCKET 26POS 0.079 GOLD PCB

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Parameter Info

User Guide

Mfr	Samtec Inc.
Style	Board to Board or Cable
Series	ESQT
Package	Bulk
Features	-
Termination	Solder
Applications	-
Contact Type	Forked
Contact Shape	Square
Mounting Type	Through Hole
Connector Type	Elevated Socket
Fastening Type	Push-Pull
Number of Rows	2
Pitch - Mating	0.079" (2.00mm)
Product Status	Active
Voltage Rating	-
Contact Material	Phosphor Bronze
Insulation Color	Black
Insulation Height	0.553" (14.05mm)
Ingress Protection	-
Base Product Number	ESQT-113
Insulation Material	Liquid Crystal Polymer (LCP)
Number of Positions	26
Row Spacing - Mating	0.079" (2.00mm)
Contact Finish - Post	Tin
Contact Length - Post	0.297" (7.55mm)
Current Rating (Amps)	4.5A per Contact
Operating Temperature	-55°C ~ 125°C
Mated Stacking Heights	-
Contact Finish - Mating	Gold
Number of Positions Loaded	All
Material Flammability Rating	UL94 V-0
Contact Finish Thickness - Post	-
Contact Finish Thickness - Mating	20.0µin (0.51µm)