HPF-20-01-T-S-08
Samtec Inc.
Product No:
HPF-20-01-T-S-08
Manufacturer:
Package:
-
Batch:
-
Datasheet:
-
Description:
.200 HI POWER SOCKET ASSEMBLY
Quantity:
Delivery:
Payment:
In Stock : 100 
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
10.3075
10.3075
10
9.2758
92.758
100
8.289605
828.9605
500
6.945336
3472.668
1000
6.138786
6138.786
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Product Information
Parameter Info
User Guide
| Mfr | Samtec Inc. |
| Style | Board to Board |
| Series | HPF |
| Package | Tube |
| Features | - |
| Termination | Solder |
| Applications | - |
| Contact Type | Female Socket |
| Contact Shape | Square |
| Mounting Type | Through Hole |
| Connector Type | Receptacle |
| Fastening Type | Push-Pull |
| Number of Rows | 1 |
| Pitch - Mating | 0.200" (5.08mm) |
| Product Status | Active |
| Voltage Rating | - |
| Contact Material | Beryllium Copper |
| Insulation Color | Black |
| Insulation Height | 0.351" (8.92mm) |
| Ingress Protection | - |
| Base Product Number | HPF-20 |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Number of Positions | 20 |
| Row Spacing - Mating | - |
| Contact Finish - Post | Tin |
| Contact Length - Post | 0.102" (2.60mm) |
| Current Rating (Amps) | - |
| Operating Temperature | - |
| Mated Stacking Heights | - |
| Contact Finish - Mating | Tin |
| Number of Positions Loaded | 19 |
| Material Flammability Rating | - |
| Contact Finish Thickness - Post | - |
| Contact Finish Thickness - Mating | - |
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