HSB11-252518
CUI Devices
Product No:
HSB11-252518
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, BGA, 25 X 25 X 18 MM
Quantity:
Delivery:
Payment:
In Stock : 54 
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
1.216
1.216
10
1.15235
11.5235
25
1.12176
28.044
50
1.09155
54.5775
100
1.030845
103.0845
250
0.970254
242.5635
500
0.909606
454.803
1000
0.848968
848.968
5000
0.818644
4093.22
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Product Information
Parameter Info
User Guide
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 0.984" (25.00mm) |
| Length | 0.984" (25.00mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.709" (18.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 13.70°C/W |
| Power Dissipation @ Temperature Rise | 5.5W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 4.50°C/W @ 200 LFM |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
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