HSB21-454515
CUI Devices
Product No:
HSB21-454515
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, BGA, 45 X 45 X 15 MM
Quantity:
Delivery:
Payment:
In Stock : 380 
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
2.0235
2.0235
10
1.9703
19.703
25
1.9171
47.9275
50
1.81051
90.5255
100
1.70411
170.411
250
1.597558
399.3895
500
1.54432
772.16
1000
1.384558
1384.558
5000
1.35793
6789.65
Not the price you want? Send RFQ Now and we'll contact you ASAP.
Product Information
Parameter Info
User Guide
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 1.772" (45.00mm) |
| Length | 1.772" (45.00mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.591" (15.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 7.56°C/W |
| Power Dissipation @ Temperature Rise | 9.9W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 2.80°C/W @ 200 LFM |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
Quick Links
